Bach 1.0 - Underfill Removal Blade

MACH BLADE SERIES - MA1.0 UNDERFILL REMOVAL BLADE <ul> <li> This blade helps you removing underfill from the logic board around IC Chips to help the microsoldering process. </li> <li> 2mm blade easily copes with a variety of small size ic. </li> <li> 1. Heated by hot air gun, </li> <li> 2. Cut the side edge of the blade and take it out. </li> </ul> <br> <a href="https://www.youtube.com/watch?v=RQ4UbOMofWE" target="_blank"><img src="https://static.mobilesentrix.com/catalog/product/m/a/mach-1.0.jpg" width="500" height="1000"></a>