Mechanic 559 Solder Flux Paste (100g / Blue Bottle)

<ul class="description"> <li>It can be used for rework sphere or pin attachment to bga pga and csp packages and assemble operations such as flip chip attachment to pwb substrates it is a necessary and helpful tool in bga reballing. </li> <li>Excellent capacity of solder-stickiness excellent anti-wet capacity widely used on bga pga csp packages and flip chip operation suitable for multiple pcb reflow no-clean and lead free for environmental protection.</li> </ul>